| >依拖多项专利技术 ●双摆臂PICK机构,最快70ms/ Cycle ●可程控式Pick force:控制 ●单多顶针兼容 ●最大支持6英寸Wafer | ●一体化兼容入料设计 ●卷对卷送料机构 ●快换式工作台设计 ●针对不同尺寸之框架只需更换压板简单调节后即可实现快速换装 |
系統能力( System Performance) 設施要求( Facilities Required)
粘片周期( Cycle time) | ≈70ms/pcs | 電壓( Voltage) | 220 VAC |
生產效率(UPH)-4焊頭 | >100Kpcs(by | 功耗(power dissipation) | 1.0kw |
芯片位置(X-Y placement) | ±1.5mil(±40μm) | 頻率( Frequency) | 50/60 Hz |
芯片旋轉(Die rotation) | ±3° | 壓缩空氣(Compressed air) | >4.5 bar |
芯片倾斜(Die tilt) | <3°(die size:<10x | 真空( Vacuum) | <-85kpa |
| <2°(die size:>10x |
|
物料處理能力( Material Handling C apability) 觀測系統( Pattern Recognition System)
晶片尺寸( Die size) | 5*5mil~ 220*220mil | 圖像識別系統( PR System) | 256 grey levels |
引線框架尺寸( Leadframe) | 卷对卷软板 | 分辨率( Resolution) | 512 pixels*512 |
長度( Length) | < 300mm | 圖像識別精確度(PR accuracy) | ±1/4 pixel |
寬度( Width) | < 140mm |
|
|
厚度( Thicknes) | 0.1mm~ 2mm |
| |
晶圆尺寸(Wafer handling) | 4” |
| |
焊料(Epoxy) | Ag Epoxy/Solder |
|
焊頭系統( Bond Head System) 體積及重量( Dimensions& Weight)
粘片/拾晶壓力(Bond/ Pick | 20~300g | 長x寬x高( L*W*H) | 1700mm*1900mm* |
|
| 重量( Weight) | ≈1000KG |
Recommended Products
